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Plating basics

The bench plating sequence for rhodium and gold, with the manufacturer's operating range for Legor rhodium baths.

The plating sequence

Plating only sticks to a perfectly clean surface, so most of the work happens before the piece goes into the plating bath.

  1. Finish and cleanPolish the piece completely, since plating shows every scratch. Remove polishing compound with ultrasonic cleaning and steam.
  2. ElectrocleanConnect the piece to the negative lead and a stainless steel anode to the positive lead in heated electrocleaner. This step is essential before rhodium.
  3. RinseRinse in distilled water to stop carrying cleaner into the next tank.
  4. ActivateDip in acid activator with no current, then rinse in distilled water again.
  5. PlatePiece on the negative lead, platinized titanium anode on the positive lead, at the voltage and time on the solution's data sheet.
  6. Recovery rinseRinse first in a still recovery rinse to save solution, then in clean distilled water.
  7. DrySteam or blow dry, and let the piece cool before handling.

Legor rhodium operating range

Legor publishes these parameters for its RH family rhodium baths. Always check the data sheet for the exact product you are using.

Parameter Range (optimal)
Voltage 2–6 V (4 V)
Working temperature 18–50 °C (25–30 °C)
Treatment time 20–60 seconds (40 seconds)
Anode Platinized titanium
Anode to cathode ratio 1:1 to 4:1 (2:1)
Water Demineralized water, below 3 µS/cm

Rhodium baths are strongly acidic and corrosive. Wear gloves and eye protection and work with ventilation.

Plating silver

Rhodium over sterling silver usually needs an underlayer, and nickel or palladium are commonly used. Palladium avoids nickel allergy concerns. Follow your rhodium solution's instructions for the recommended base.

Pen plating

Pen platers apply rhodium or gold to small areas, such as two-tone work or touch-ups, without a full bath. Clean and activate the area first, exactly as for bath plating.

Plating solutions and supplies

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